low temperature cured epoxy adhesive

DM6106 black low temperature cured epoxy adhesive

DM6106 black low temperature cured epoxy adhesive,

low temperature cured epoxy adhesive,
low temperature cured epoxy adhesive,

low temperature cured single component heat cured epoxy resin adhesive, low temperature cured epoxy adhesive M-6106 is a single component heat cured epoxy resin. This product is suitable for low-temperature curing, extremely low precipitation, high moisture resistance, and has good adhesion to many materials. Typical applications include storage cards and CCD/CMOS components.

Especially suitable for situations where low curing temperature is required for thermal sensitive components Epoxy resin adhesive DM-6106 black low-temperature cured epoxy resin adhesive, low-temperature cured single component thermally cured epoxy resin adhesive characteristics 1 low-temperature curing

2 excellent adhesion

3 low precipitation DM-6106 black low-temperature cured epoxy resin adhesive, low-temperature cured single component thermally cured epoxy resin adhesive physical properties please request product TDS

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