shadowless glue

UV glue manufacturers share the main formula of UV shadowless glue

UV glue manufacturers share the main formula of UV shadowless glue

shadowless glue
shadowless glue

Prepolymer: 30-50%
Acrylic monomer: 40-60%
Photoinitiator: 1-6%
Additive: 0.2~1%
Prepolymers include: epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate, propylene
Acrylic resin, etc
Monomers include: monofunctional (IBOA, IBOMA, HEMA, etc.), bifunctional
(TPGDA, HDDA, DEGDA, NPGDA, etc.), trifunctional and polyfunctional (TMPTA, PETA, etc.)
Initiators include: 1173184907, benzophenone, etc
Additives can be added or not added
Formula for Shadowless Adhesive

UV glue manufacturers share the main formula of UV shadowless glue

Formula 1]
711 # Epoxy resin 60 Methyl methacrylate 40 Benzoin methyl ether
This formula is mainly used for bonding transparent materials such as glass or organic glass with metals or plastics. Suitable for assembly line production
Construction. The curing conditions are 80W high-pressure mercury lamp, irradiation distance of 4cm, and irradiation for 3 minutes. Shear strength of organic glass and aluminum
The alloy is greater than 6MPa; Glass and ABS plastic have a strength greater than that of the glass itself; Organic glass and ABS plastic are large
At 4.6 MPa.

UV glue manufacturers share the main formula of UV shadowless glue

[Formula 2]
Epoxy acrylate 100, diallyl phthalate 30, benzoin ether 2
Hydroquinone 0.075 dibutyl phthalate 5
This formula is suitable for bonding ceramic resonators and precision delay lines of color TVs, and can also be used for the manufacturing and printing of fiberglass reinforced plastic
Version, etc. When curing, use a black light as the light source, and the light distance and duration should be determined according to the size of the light source to ensure complete curing
It is appropriate.

UV glue manufacturers share the main formula of UV shadowless glue

Formula for latent curing adhesive
[Formula 1]
E-44 epoxy resin 100 polysulfide rubber 10 MS-1 microcapsules 38
In this formula, MS-1 microcapsules are small particles of curing agent diaminodiphenylmethane encapsulated in polyvinyl alcohol and gelatin
Ball, with a diameter of 10-50u. Applicable to the application range of general epoxy resin adhesives. This formula is a single component and can be stored for a long time,
Convenient construction. The curing conditions are 150 ° C for 2 hours. The shear strength is 22-28MP. The uneven pulling strength is 410N/cm.

UV glue manufacturers share the main formula of UV shadowless glue

Formula for electrostatic flocking adhesive
[Formula 1]
Polyethylene glycol phenyl ether 40 N-hydroxymethyl acrylamide aqueous solution 173 acrylic acid ester mixture
Compound 607 Potassium persulfate 2.1 Sodium bisulfite 2.1
This formula is suitable for woolen products made by flocking, such as carpets. During construction, prepare the adhesive solution with the above components
Apply to the base cloth, immediately use an electrostatic flocking machine to fluff, then dry at 70-100 ° C, followed by drying at 120-160 ° C, and cool
Afterwards, the remaining fluff is collected and sorted using a brush coating method. The woolen products made with this formula have a good hand feel and are resistant to washing.

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