POTTING GLUE,Introduction to the Operation Methods for LED Driver Power Supply Encapsulant
Silicone encapsulant is a type of adhesive that becomes elastic after curing, providing thermal conductivity, flame retardancy, and ease of maintenance. It is the preferred product for encapsulating and filling electronic and electrical products.
LED driver power supply encapsulant is suitable for the encapsulation and protection of general electronic components, power modules, and circuit boards, as well as for various electronic devices, such as switch power supplies, driver power supplies, automotive HID lamp module power supplies, automotive ignition system module power supplies, appliance controllers, and network transformers. Many customers are unfamiliar with the usage of LED driver power supply encapsulant. Here, our adhesive engineer will explain the operation methods for utilizing LED driver power supply encapsulant:
- Mixing: Before combining, ensure that components A and B are thoroughly stirred separately to avoid performance changes or uneven curing due to sedimentation of fillers.
- Combination: Weigh the two components in a 1:1 (by weight) ratio and mix them in a prepared container until homogeneous. Uneven mixing can negatively affect performance after curing.
- De-gassing: Allow the mixed adhesive to sit for 10-20 minutes or use a vacuum to de-gas.
- Pouring: Complete the pouring within the operational time frame, as delays can impact leveling. The substrate surface should be clean and dry prior to encapsulation.
- Curing: Both room temperature and heated curing are acceptable. The curing speed of the adhesive is highly dependent on the curing temperature. In winter, curing may take a long time, so heating is recommended. Curing at 80°C should last 30-60 minutes, while at room temperature, it generally takes around 3-6 hours.
These are the recommended methods for using silicone encapsulant and power supply encapsulant as introduced by our adhesive company engineer. We hope this information is helpful.
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