DM7817 MiniLED backlight organic silicon packaging adhesive

M-7817 optical organic silicone dam filling packaging adhesive MiniLED backlight module packaging, Mini LED organic silicon packaging adhesive, suitable for dam filling packaging process. After curing, it provides high refractive index while maintaining high transparency, which helps to improve the light efficiency of backlight modules. It also has characteristics such as moisture resistance, waterproofing, and weather aging resistance, and is mainly used in Mini LED chip packaging.

DM-7817 filling encapsulation adhesive is a two-component heat cured silicone encapsulation adhesive designed for mini LED COB packaging. The product has good leveling performance, is easy to inject, and is flat, smooth, and free of bubbles after curing. Simultaneously, it has excellent high and low temperature resistance, low internal stress, and good adhesive performance.
High transparency: The optical dam filling and packaging adhesive has high transparency, which can ensure the clarity and brightness of optical equipment.
Low refractive index: The refractive index of the optical dam filling and packaging adhesive is very low, which can reduce the reflection and scattering of optical equipment and improve its optical performance.
High temperature resistance: The optical dam filling and packaging adhesive has good high-temperature resistance performance, which can maintain stability and reliability in high-temperature environments.
Good weather resistance: The optical dam filling and packaging adhesive has excellent weather resistance, which can resist natural environmental erosion such as UV and oxidation, and maintain long-term stability and reliability.