产品性能指标
指标 | 单位 | 数值 |
粘度 |
cps |
17000 |
触变系数 |
2.6 |
|
开放时间 |
hour |
48 |
固化时间@150℃ |
min |
30 |
透光率 |
% |
>90 |
折射率 |
1.48 |
|
硬度 | 邵氏A |
70 |
MiniLED backlight organic silicon lens molding adhesive instructions
1. This product should be stored in a low-temperature environment and left at room temperature for 2 hours before use.
2. Before use, clean the surface of the encapsulated components to remove oil stains and other impurities (volatile organic solvents can be used), and then apply the product to the components that need to be bonded.
3. Bake the packaged components at 150 ℃ for 30 minutes to cure.
4. If not used up after opening, it should be sealed again and stored at low temperature to prevent the product from absorbing moisture and affecting quality.
matters needing attention
Some materials, chemicals, curing agents and plasticizers can inhibit the curing of gelled materials. Pay attention to avoid contact with the following substances.
1. Organotin and other organometallic compounds;
2. Sulfur, polysulfides, polysulfides or other sulfur-containing substances;
3. Amine, polyurethane rubber or items containing ammonia, epoxy resin with curing agent added;
4. Items containing phosphorous or phosphorous;
5. Some flux residues.
Storage conditions
This product is packaged in a 50cc syringe and can be negotiated with the user to specify the packaging (it can be transported and stored as non dangerous goods).
The product has a shelf life of 3 months when stored at low temperatures ranging from -20 ℃ to 0 ℃. If the retest is overdue and meets the standards, it can still be used.