Low temperature curing epoxy resin adhesive DM6120 thermal sensitive component adhesive
Product Overview
DM-6120 is a single component thermosetting epoxy resin. This product is suitable for low-temperature curing and has good adhesion to various materials in a relatively short period of time. Typical applications include memory cards and CCD/CMOS components.
Characteristics of Thermistor Adhesive Products
1. Low temperature curing
2. Excellent adhesion
3. Black paste epoxy resin
Application of Thermistor Adhesive Products
Suitable for situations where low curing temperature is required for thermistor components
Physical properties of thermal sensitive component adhesive
| 指标 Property | 单位 Unit | 数值 Value | 方法 Method |
| 颜色/Color | 黑色 Black | 目视visual | |
| 基本化学成份 / Chemical composition | 环氧树脂 Epoxy resin |
||
| 固化方式/Cure | 加热 Heat | ||
| 粘度 Viscosity (mPa.s@25℃) | 3000±500 | GB/T2794-2013 | |
| 密度 Gravity | g/cm3 | 1.36 | |
| 固化方式/Cure Schedule | min | 5~10min/80℃ | |
| 硬度 Hardness (邵氏D) | 79 | GB/T 2411-2008 | |
| 拉伸强度 Tensile Strength | N/mm2 | 13 | |
| 收缩率/ Linear shrinkage | % | 1.3 | GB/T 1040-2018 |
| 玻璃转化温度(TMA) | ℃ | 26 | |
| 热膨胀系数 Coefficient of thermal expansionα1 |
PPM/℃ | 61 | |
| 热膨胀系数 Coefficient of thermal expansionα2 |
PPM/℃ | 170 |
Storage conditions for thermal sensitive component adhesive
The product is sealed and stored in a clean and dry place at -15 ℃. The shelf life is 6 months
