Electronic potting glue and epoxy resin potting glue from glue manufacturers
glue manufacturers
Let’s first understand what sealing is? Sealing (gluing) is the process of using equipment or manual methods to pour epoxy resin sealing adhesive into devices containing electronic components and circuits, and curing them into high-performance thermosetting polymer insulation materials under normal temperature or heating conditions, thereby achieving the purpose of bonding, sealing, sealing, and coating protection.
Donglai HT-8345 electronic potting adhesive is mainly used in transformers, high-voltage packs, transformers, drivers, power controllers, LED modules, electronic induction modules, etc. It mainly plays a role in potting confidentiality, insulation protection, thermal conductivity and heat dissipation, waterproof and moisture-proof.
Donglai HT-8345 Electronic Sealing Adhesive Product Features:
1. Two component, room temperature curing, low shrinkage rate, strong permeability, high glossiness, high and low temperature resistance, and crack resistance.
2. After curing, the surface is smooth, without bubbles, with high hardness, acid and alkali resistance, waterproof, moisture-proof, dustproof, and insulation, pressure resistance, and thermal conductivity.
3. Full tank sealing protects core components, reduces the impact of external environmental conditions on components after curing, ensures good operation of components in standard working environments, and improves the normal stability and service life of components.
Pre treatment of Donglai HT-8345 electronic sealing adhesive: Clean the products that need to be sealed, remove dust and stains.
1. Proportion: A：B = 2： 1 (weight ratio)
2. Useful time: 25 ℃ x 30 minutes (100g mixing amount)
3. Curing conditions: 25 ℃ for 2-3 hours or 80 ℃ for 1 hour
4. The surface of the product to be coated with glue needs to be kept dry and clean;
5. Take the amount according to the ratio and weigh accurately. Please remember that the ratio is a weight ratio rather than a volume ratio. After mixing A and B agents, they should be thoroughly stirred to avoid incomplete curing;
6. After stirring evenly, please pour the glue in a timely manner and try to use up the mixed glue solution within the available time;
During the curing process, please keep the product horizontally placed to prevent the glue from overflowing during the curing process.
8. Usually, the mixed adhesive needs to be vacuumed to remove bubbles, and the cured adhesive will be more beautiful, shiny, and neat.
9. The mixed glue must be used up within the usable time, otherwise the glue will start to gel and cause waste.
Electronic potting glue and epoxy resin potting glue from glue manufacturers
Electronic sealing adhesive | Epoxy resin sealing adhesive | Electronic component sealing adhesive | Thermal conductive sealing adhesive | AB sealing adhesive | Sealing adhesive manufacturers come from the east, such as transformers, high-voltage packages, sensors, circuit boards, electronic components, etc., which play a role in sealing confidentiality, insulation protection, thermal conductivity and heat dissipation, waterproof and moisture-proof. Especially its excellent waterproof performance makes it an indispensable main waterproof material in the field of electronic component waterproofing. It can be used for manual operation and is suitable for most automation equipment applications. For more information, please consult Ms. Yang from Donglai Glue on her phone and WeChat account. We will provide free samples for testing the results!
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We have strong research and development capabilities and are a trusted manufacturer. Welcome to call or sales@molddl.com Consultation, please contact us for free samples!
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