Adhesive Manufacturer Share, Epoxy Resin AB Adhesive 123
Oxygen resin AB adhesiveEpoxy resin AB adhesive is formulated by adding curing agent, filler, etc. to epoxy resin. High bonding strength, high hardness, good rigidity, able to resist acid, alkali, oil and organic solutions, with small curing shrinkage. It can be used as a structural adhesive and building sealing material for materials such as metal, cement, ceramics, glass, stone, wood, thermosetting plastics, etc.
Principle analysis: In the formula, epoxy resin and polyvinyl chloride resin are the main adhesive components; Di (2-ethylhexyl) phthalate as a plasticizer; Quartz powder and white carbon black are used as filling modifiers; Boron trifluoride glycerol, boron trifluoride aniline, and diethylenetriamine as curing agents; Phosphoric acid acts as an acidifying agent, promoting curing and increasing adhesion to metals. Two component room temperature cured epoxy resin AB adhesive. After applying this product to the bonded surface, apply a certain amount of pressure. It can be cured at room temperature.
The curing conditions are: 14-16 seconds at 16.5 degrees Celsius, 7-9 seconds at 25 degrees Celsius, and 4-6 seconds at 30 degrees Celsius. It is mainly used for bonding various metal to metal, metal to non-metal, and various hard plastic products, with high bonding strength.
Epoxy resin AB adhesive generally refers to an adhesive prepared with epoxy resin as the main resin, which should generally include epoxy resin and epoxy resin curing agent. Otherwise, the adhesive will not cure. Let’s learn more about the excellent properties of epoxy resin adhesive together with the editor of Kejia Adhesive! 1: The highly active epoxy groups, hydroxyl groups, ether bonds, amine bonds, ester bonds, and other polar groups in the epoxy resin curing system endow the cured epoxy with extremely high adhesive strength.
In addition, it has high mechanical properties such as cohesive strength, so its adhesive performance is particularly strong,
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2: Epoxy resin with high mechanical properties has strong cohesion and a dense molecular structure, so its mechanical properties are higher than general thermosetting resins such as phenolic resin and unsaturated polyester.
3: Epoxy resin that is stable and free of impurities such as alkali and salt is not easily deteriorated, and epoxy cured products have excellent chemical stability. Its corrosion resistance to various media such as alkali, acid, and salt is superior to thermosetting resins such as unsaturated polyester resin and phenolic resin.
4: Epoxy resin with good processability does not produce low molecular weight volatiles during curing, so it can be formed under low pressure or contact pressure. The flexibility of formula design is great, and formulas suitable for various process requirements can be designed.
5: Basic characteristics: two-component adhesive that requires AB mixing and has strong versatility. It can fill large gaps. 6. It can be cured at room temperature in both indoor and outdoor environments, and can be manually mixed or used with AB glue specialized equipment (such as AB glue gun). Epoxy adhesive bonding strength enhancement method: Although the bonding strength of epoxy resin AB adhesive is relatively high, it is still insufficient for some high-strength structural bonding, and further improvement of bonding strength is needed. The following methods can be used to enhance the bonding strength.
Improve adhesive strength
1: The addition of reinforcing fillers reduces the thermal expansion coefficient and curing shrinkage rate of the cured material, and reduces internal stress. When cracks appear due to overload, the adhesive layer with filler can also prevent crack propagation, thereby improving the bonding strength. For example, epoxy adhesives used for bonding metal structures can increase shear strength by adding an appropriate amount of iron powder. Enhanced fillers include silica micro powder, white carbon black, wollastonite powder, alumina, ultrafine aluminum silicate, lightweight oxide inlay, talc powder, sepiolite powder, attapulgite powder, ultrafine calcined kaolin, iron oxide powder, iron powder, aluminum powder, zinc powder, glass flakes, stainless steel scales, dolomite powder, etc.
2: Inorganic whisker reinforced whiskers are extremely small diameter fibers grown in single crystal form under special conditions, with a highly ordered atomic arrangement structure that can approach the theoretical strength of interatomic valence bonds. They have great potential for enhancing epoxy adhesives. The available crystal whiskers include zinc oxide whiskers, calcium sulfate whiskers, calcium carbonate whiskers, aluminum borate whiskers, titanium based whiskers, hydroxyapatite whiskers, magnesium hydroxide whiskers, basic magnesium sulfate whiskers, silicon carbide whiskers, etc.
3: Fiber reinforced glass fiber, carbon fiber, aromatic polyamide fiber (Kevlar fiber), vinylon fiber, polyvinyl alcohol fiber, polyphenylene sulfide fiber, stainless steel fiber, basalt fiber, calcite fiber, etc. can all enhance epoxy adhesives. If you want to learn more about epoxy resin AB adhesive, quick drying adhesive and other information, please visit our company’s official website for inquiry. http://www.aicarder.com/
