Introduction to Thermal Conductive Flame Retardant Organic Silicon Sealing Adhesive from Adhesive Manufacturers

1. 【Organic Silicon Sealing Adhesive
Product Features】

1.1. Two-component, medium viscosity, gray, thermally conductive, flame-retardant, environmentally friendly electronic potting adhesive and sealant.

1.2. It exhibits excellent properties such as high-temperature and high-pressure resistance, solvent resistance, aging resistance, weather resistance, and low shrinkage.

1.3. After curing, it becomes an elastomer with good toughness, not brittle, does not harden, is disassemblable, and components sealed with it can be removed for repair or replacement. The repair can be done seamlessly using this product without leaving any traces. It is waterproof, moisture-proof, and resistant to impact and vibration.

1.4. Capable of withstanding high and low temperatures and showing good chemical resistance, it can cure at room temperature or with heating, making it convenient and efficient.

Introduction to thermal conductive flame-retardant silicone potting adhesive from the adhesive manufacturer.

2. 【Organic Silicon Sealing Adhesive
Application Range】

The 5162 gray thermally conductive flame-retardant electronic potting adhesive and sealant is suitable for the following products and applications:

2.1. Applicable for potting and sealing power electronic components that require flame retardance and thermal conductivity, as well as for potting high-voltage components.

2.2. Used for potting the power batteries of new energy electric vehicles, waterproof power sources, thermally conductive potting for lightning protection devices, and potting of HID lamps.

2.3. Potting of heat-producing electronic components under operational conditions, such as converters, inverters, sensors, electronic control units, etc.

2.4. Shock protection for precision mechanical and instrument parts, as well as potting protection for small appliances. Suitable for potting all types of circuit boards.

2.5. High-temperature thermally conductive flame-retardant potting for small home appliances and household appliance control boards.

Introduction to thermal conductive flame-retardant silicone potting adhesive from the adhesive manufacturer.

3. 【Organic Silicon Sealing Adhesive
Technical Specifications】

Indicator Name		Condition/Unit	Component A	B component
Before solidification	Product Name/Model	/	5162 A	5162B
	Brand/Origin	/	Shenzhen	/Shenzhen
	appearance	Visual inspection	Grey liquid	White liquid
	Viscosity	25℃/mpa.s	2500	2000
	Mixing ratio	Weight ratio	100：100
	Density	25℃,g/cm3	1.35－1.45
	Viscosity after mixing	25℃/mpa.s	2000－2500
	Operable time	25℃/min	60－90
	Table drying time	25℃/h	1-2
	Practical time	25℃/h	6－8 ,（60℃，1h）
After solidification	Hardness	shore A	35-45
	tensile strength	Mpa	1.5-2.0
	elongation	100%	100
	breakdown voltage	KV/mm	≥18
	Dielectric constant	60Hz	2.5
	Volume resistivity	Ω.㎝	≥1.0×1014
	Dielectric loss factor	60Hz	0.003
	Usage temperature	℃	-60～200
	thermal conductivity	（W/m.k）	0.6-0.9
	Flame retardancy	UL94	FV-0
	Waterproof grade	/	IP67
	Maintainability	/	y

The mechanical and electrical properties of the above products are both at 25 ℃, relative temperature of 60%, and fully cured for 7 days.

Introduction to Thermally Conductive and Flame Retardant Silicone Encapsulation Adhesive from Adhesive Manufacturer

4. [Usage Instructions]

1. Before mixing, it is recommended to thoroughly stir components A and B, as the thermal conductivity materials in the adhesive may settle over time. Mixing them well will enhance performance and thermal efficiency.

2. Use the adhesive in a weight ratio of A:B=(100:100) according to your needs. During mixing, ensure the adhesive is stirred evenly, and after degassing (which can be done via vacuum or settling), you can proceed with the encapsulation application.

3. Prior to application, clean the surfaces of the components to remove dust, grease, moisture, and other impurities, ensuring they remain dry.

5. [Precautions]

1. During production, enhanced ventilation and personal protective measures should be implemented. Open flames are strictly prohibited, and you should maintain distance from heat sources.

2. When handling, be gentle, and ensure packaging lids are securely closed in a timely manner. Tools and equipment used should be cleaned immediately for future use.

3. Avoid allowing the adhesive to come into contact with compounds containing nitrogen, sulfur, phosphorus, or metal organic acids during use; otherwise, the adhesive may not cure or may cure incompletely. The operational and curing times of the encapsulation adhesive are temperature-dependent—the higher the temperature, the shorter the workable time.

4. Testing of performance parameters should be conducted at least three days after the adhesive has fully cured, at which point the values will reach stability.

5. For further information and related data, please consult us for advice and assistance.

Introduction to Thermal Conductive Flame Retardant Organic Silicon Sealing Adhesive from Adhesive Manufacturers

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With strong R&D capabilities, we are a trusted manufacturer. For inquiries, please contact us or email sales@molddl.com for free samples!
This article is collected in Baidu Wenku.