Organic Silicon Sealing Adhesive

Introduction to Thermal Conductive Flame Retardant Organic Silicon Sealing Adhesive from Adhesive Manufacturers

Introduction to Thermal Conductive Flame Retardant Organic Silicon Sealing Adhesive from Adhesive Manufacturers

Organic Silicon Sealing Adhesive
Organic Silicon Sealing Adhesive
1. 【Organic Silicon Sealing Adhesive
Product Features】

1.1. Two-component, medium viscosity, gray, thermally conductive, flame-retardant, environmentally friendly electronic potting adhesive and sealant.

1.2. It exhibits excellent properties such as high-temperature and high-pressure resistance, solvent resistance, aging resistance, weather resistance, and low shrinkage.

1.3. After curing, it becomes an elastomer with good toughness, not brittle, does not harden, is disassemblable, and components sealed with it can be removed for repair or replacement. The repair can be done seamlessly using this product without leaving any traces. It is waterproof, moisture-proof, and resistant to impact and vibration.

1.4. Capable of withstanding high and low temperatures and showing good chemical resistance, it can cure at room temperature or with heating, making it convenient and efficient.

Introduction to thermal conductive flame-retardant silicone potting adhesive from the adhesive manufacturer.

2. 【Organic Silicon Sealing Adhesive
Application Range】
Organic Silicon Sealing Adhesive
Organic Silicon Sealing Adhesive

The 5162 gray thermally conductive flame-retardant electronic potting adhesive and sealant is suitable for the following products and applications:

2.1. Applicable for potting and sealing power electronic components that require flame retardance and thermal conductivity, as well as for potting high-voltage components.

2.2. Used for potting the power batteries of new energy electric vehicles, waterproof power sources, thermally conductive potting for lightning protection devices, and potting of HID lamps.

2.3. Potting of heat-producing electronic components under operational conditions, such as converters, inverters, sensors, electronic control units, etc.

2.4. Shock protection for precision mechanical and instrument parts, as well as potting protection for small appliances. Suitable for potting all types of circuit boards.

2.5. High-temperature thermally conductive flame-retardant potting for small home appliances and household appliance control boards.

Introduction to thermal conductive flame-retardant silicone potting adhesive from the adhesive manufacturer.

3. 【Organic Silicon Sealing Adhesive
Technical Specifications】

Indicator Name

Condition/Unit

Component A

B component

Before solidification

Product Name/Model

/

5162 A

5162B

Brand/Origin

/

Shenzhen

/Shenzhen

appearance

Visual inspection

Grey liquid

White liquid

Viscosity

25℃/mpa.s

2500

2000

Mixing ratio

Weight ratio

100:100

Density

25℃,g/cm3

1.35-1.45

Viscosity after mixing

25℃/mpa.s

2000-2500

Operable time

25℃/min

60-90

Table drying time

25℃/h

1-2

Practical time

25℃/h

6-8 ,(60℃,1h)

After solidification

Hardness

shore A

35-45

tensile strength

Mpa

1.5-2.0

elongation

100%

100

breakdown voltage

KV/mm

≥18

Dielectric constant

60Hz

2.5

Volume resistivity

Ω.

≥1.0×1014

Dielectric loss factor

60Hz

0.003

Usage temperature

-60~200

thermal conductivity

(W/m.k)

0.6-0.9

Flame retardancy

UL94

FV-0

Waterproof grade

/

IP67

Maintainability

/

y

The mechanical and electrical properties of the above products are both at 25 ℃, relative temperature of 60%, and fully cured for 7 days.

Introduction to Thermally Conductive and Flame Retardant Silicone Encapsulation Adhesive from Adhesive Manufacturer
Organic Silicon Sealing Adhesive
Organic Silicon Sealing Adhesive

4. [Usage Instructions]

1. Before mixing, it is recommended to thoroughly stir components A and B, as the thermal conductivity materials in the adhesive may settle over time. Mixing them well will enhance performance and thermal efficiency.

2. Use the adhesive in a weight ratio of A:B=(100:100) according to your needs. During mixing, ensure the adhesive is stirred evenly, and after degassing (which can be done via vacuum or settling), you can proceed with the encapsulation application.

3. Prior to application, clean the surfaces of the components to remove dust, grease, moisture, and other impurities, ensuring they remain dry.

5. [Precautions]

1. During production, enhanced ventilation and personal protective measures should be implemented. Open flames are strictly prohibited, and you should maintain distance from heat sources.

2. When handling, be gentle, and ensure packaging lids are securely closed in a timely manner. Tools and equipment used should be cleaned immediately for future use.

3. Avoid allowing the adhesive to come into contact with compounds containing nitrogen, sulfur, phosphorus, or metal organic acids during use; otherwise, the adhesive may not cure or may cure incompletely. The operational and curing times of the encapsulation adhesive are temperature-dependent—the higher the temperature, the shorter the workable time.

4. Testing of performance parameters should be conducted at least three days after the adhesive has fully cured, at which point the values will reach stability.

5. For further information and related data, please consult us for advice and assistance.

Introduction to Thermal Conductive Flame Retardant Organic Silicon Sealing Adhesive from Adhesive Manufacturers

We welcome new and existing customers to inquire. We support small batch and customized appearance orders. We offer free 1-on-1 technical consulting services! Our R&D center in the Shenzhen Guangming Pilot Industrial Base spans over 3,000 square meters and includes 12+ laboratories. We encourage inquiries from all customers. Our company supports small batch customization and packaging design.

With strong R&D capabilities, we are a trusted manufacturer. For inquiries, please contact us or email sales@molddl.com for free samples!
This article is collected in Baidu Wenku.

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