DM6106 black low temperature cured epoxy adhesive

low temperature cured single component heat cured epoxy resin adhesive, low temperature cured epoxy adhesive M-6106 is a single component heat cured epoxy resin. This product is suitable for low-temperature curing, extremely low precipitation, high moisture resistance, and has good adhesion to many materials. Typical applications include storage cards and CCD/CMOS components.

Especially suitable for situations where low curing temperature is required for thermal sensitive components Epoxy resin adhesive DM-6106 black low-temperature cured epoxy resin adhesive, low-temperature cured single component thermally cured epoxy resin adhesive characteristics 1 low-temperature curing

2 excellent adhesion

3 low precipitation DM-6106 black low-temperature cured epoxy resin adhesive, low-temperature cured single component thermally cured epoxy resin adhesive physical properties please request product TDS