Low temperature cured epoxy adhesive 6118, CCD, CMOS component thermal conductive adhesive
DM-6118 is a single component thermosetting epoxy resin. This product is suitable for low-temperature curing and has good adhesion to various materials in a relatively short period of time, while also possessing certain thermal conductivity. Typical applications include storage cards and CCD/CMOS components.
Low temperature cured epoxy adhesive 6118, CCD, CMOS component thermal conductive adhesive
Product Information
Technical system | epoxy |
appearance | Black liquid |
form | Single component |
Curing method | Heating curing |
Product features | Low temperature curing, good adhesion, and thermal conductivity |
application | Adhesion of thermosensitive materials, thermal bonding, and device encapsulatio |
index | unit | numerical value |
colour | / | black |
viscosity@25℃ | cp | 12000~18000 |
thixotropic(1/10rpm) | / | 2.8~3.5 |
proportion@25℃ | g/cm3 | 1.6 |
Opening Hours @25℃ | Days | 7 |
Storage time@-20℃ | Month | 6 |
Curing conditions@80℃ | min | 30 |
hardness | Shore D | 70~75 |
Tensile modulus | MPa | 2100 |
Glass transition temperature | ℃ | 37 |
Coefficient of thermal expansion | ppm/℃ | 42/138 |
Shear strength (stainless steel) | MPa | >16 |
thermal conductivity | W/m·K | >1.0 |
Surface insulation resistance | Ω | 1013 |
This product is not suitable for use in pure oxygen and/or enriched oxygen, and cannot be used as a sealing material for chlorine gas or other strongly oxidizing substances. Irritating to skin and eyes
Contact with skin may cause allergies. If it gets into the eyes, rinse with water for 15 minutes and see a doctor. If in contact with the skin, wash with soap and water
Keep out of reach of children
Excessive skin contact can cause skin allergies. If skin allergies occur, stop using and seek medical treatment. Coating nozzles can be used to avoid direct skin contact. For safety precautions related to this product, please refer to the Material Safety Data Sheet (MSDS)